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A primary focus is the structural integrity of microvias and plated through-holes (PTH). Manufacturers must strictly control plating thickness and ensure complete via filling to prevent defects like voids or wall fractures during thermal expansion. Advanced non-destructive testing, such as 3D X-ray inspection and Scanning Acoustic Microscopy (SAM), is employed to detect hidden internal flaws. Furthermore, boards undergo extreme environmental stress tests, including repeated thermal shock cycling and high-humidity exposure. By addressing these failure mechanisms through precise工艺 control and comprehensive testing, a High Density Interconnect PCB achieves the robust durability required for modern high-performance applications.