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  1. The Impact of Via-in-Pad on Thermal Performance and Reliability
    The Impact of Via-in-Pad on Thermal Performance and Reliability

    Via-in-pad — placing a via directly within a component land pad rather than beside it — is one of the most consequential design decisions in modern PCB layout. It affects thermal performance, solder joint integrity, manufacturing cost, and long-ter...

    https://www.high-density-interconnect-pcb.comhttps://www.high-density-interconnect-pcb.com/hdi-pcb-thermal-management/the-impact-of-via-in-pad-on-thermal-performance-and-reliability/
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