Testing high-density interconnect (HDI) PCBs presents unique challenges that traditional PCB testing methods simply cannot address. The microscopic features, buried vias, and ultra-fine pitch components that make HDI technology powerful also make t...
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Introduction When it comes to testing High Density Interconnect (HDI) PCBs, the stakes are higher than ever. These advanced circuit boards feature ultra-fine traces, micro-vias, and component densities that push the boundaries of traditional tes...
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As PCB technology advances and device geometries shrink, the humble via—the plated hole that connects layers in a printed circuit board—has become one of the most critical and most vulnerable elements in modern electronics. Microvias, defined by th...
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The semiconductor industry keeps shrinking feature sizes while packing more functionality into each chip. The result: Ball Grid Array packages with pitches of 0.4mm, 0.3mm, and even 0.2mm, mounted on HDI substrates that route signals through microv...
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