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  1. Reliability Challenges of Via-in-Pad Plating Filled (VIPPO) Technology
    Reliability Challenges of Via-in-Pad Plating Filled (VIPPO) Technology

    Via-in-pad is one of those design techniques that looks deceptively simple on a schematic but carries substantial manufacturing complexity underneath. The concept is straightforward: drill a hole at a component pad location, plate it to form an ele...

    https://www.high-density-interconnect-pcb.comhttps://www.high-density-interconnect-pcb.com/hdi-pcb-reliability/reliability-challenges-of-via-in-pad-plating-filled-vippo-technology/
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